The 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.

With different models to choose from, each optimized for a specific range of applications, the 7120 / 7130 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available.

The 7120 / 7130 Dicing System is an industry leading platform designed for a variety of applications such as:

Ceramic Substrates & Capacitors	Glass
Automotive Sensors	PZT
Glass on Silicon	LED & LED on PCB Packages
Package Singulation (BGA, QFN)	Opto-electronic Components
SAW Filters	Sensors & MEMS
LTCC	IC Wafers

7120 / 7130 Series Features & Options:

• Extra Large Area Dicing (7100 XLA)
• Large Area
• Tilting Spindle
• Dressing Station for diamonds exposure and clogging prevention

7120 / 7130 Series Advantages:

• 2” and 4” spindle dicing systems
• A full range of automatic vision capabilities
• Advanced hardware platform for high reliability and low maintenance
• Heavy Duty, cast-iron base structure for superior precision and accuracy
• Increased yield, throughput and process control
• Unique multi-panel processing capabilities
• Special blade wear forecast algorithm
• User-friendly software platform