WAFER CLEANER 977
时间：2018.04.29 浏览 517 次
Efficient compact cleaning units to support your process
ADT 977 Wafer Cleaner Systems are designed for cleaning workpieces after dicing.
The systems are offered in three basic configurations :
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WCS-977 – round wafer up to 8"
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WCS-977LA – round wafer up to 12"
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WCS-977D – a standalone coating/de-coating station with:
*Wafer spin coating technology
*Absolute surface protection during dicing
*100% removal of contamination and residue
*Atomized cleaning and N2 drying
977 System Highlights :
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Atomizing cleaning
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Automatic lid closing
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Intuitive control panel
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Process monitoring
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Compact design
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Robust, vibration free
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Environmentally friendly
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Options:
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Build-in mist exhaust unit
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CO2 injection
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Customized chucks
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Cleaning additives
Technical Specifications:
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977- 200
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977L - 300
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Max. wafer size
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Ø 200 mm
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Ø 300 mm
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Cleaning method
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Atomizing cleaning/
High pressure cleaning
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Atomizing cleaning/
High pressure cleaning
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Number of recipes that can be saved
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8
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8
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Spinner velocity range
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200–3000 rpm
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200–2500 rpm
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Machine dimensions (WxDxH)
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410 x 625 x 950 mm
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520 x 809 x 950 mm
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Approx. machine weight
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100 kg
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160 kg
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