Mounting solutions to match your specific needs

ADT Wafer Mounting Systems enable mounting of wafers/substrates to frames using various kinds of tapes.

The systems are offered in two basic configurations:

• WM-966 – up to 8" wafer
• WM-966LA – up to 12" wafer.

System Highlights:

• Uniform mounting without air bubbles
• Build-in reeling and removal of UV tape backing

• Mounting plate temperature control
• Compatibility with all film frames; linear and circular tape cutting

• Custom-made chucks for special requirements:
  • Thin wafers
  • Sensitive surface
  • Multiple panels

• Options:
  • ESD protection
  • Tape saving mechanism

Technical Specifications:

	Model 966 – 8"	Model 966 – 12"
Max.  wafer size	Ø 200 mm*	Ø 300 mm*
Max. tape width	300 mm	400 mm
Plate heating	Up to 80°C	Up to 80°C
Machine dimensions (WxDxH)	304 x 800 x 394 mm	330 x 1000 x 560 mm
Approx. machine weight	30 kg	60 kg

** Refers to standard models.