NICKEL-BOND DICING BLADES-产品展示-苏州倍晟美半导体有限公司
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NICKEL-BOND DICING BLADES

时间:2018.04.29    浏览 504 次
NICKEL-BOND DICING BLADES
. The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
. Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
. Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)