RESIN-BOND DICING BLADES
时间：2018.04.29 浏览 497 次
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Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
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Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
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Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)
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Our new "D" series Resin Blade for QFN:
