The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With resolutions down to submircon levels and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter.
Automated Optical Inspection for Microelectronics
Nordson YESTECH’s advanced megapixel technology offers high-speed device inspection with exceptional defect coverage. With high resolution and telecentric optics,M1m inspects bond wires,die placement,SMT components and substrates,all within a footprint less than 1 sq. meter.The M1m can be put in-line with your wire bonders or off-line to support several bonders.
A magazine loader/unloader is available for off-line operations.
Programming the M1m is fast and intuitive.With CAD data input, a complete recipe can be completed in less than 1 hour*. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production.
The M1m utilizes several image processing algorithms to perform a multitude of inspections historically performed manually by operators using eyepiece microscopes.Real-time color,normalized gray scale correlation,pattern matching and binary “blob”analysis are just a few of the tools used to automate the process.
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