VERSAPRINT S1-3D-产品展示-苏州倍晟美半导体有限公司
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VERSAPRINT S1-3D

时间:2018.05.02    浏览 479 次
VERSAPRINT S1-3D

The VERSAPRINT stencil printers with integrated 100% post print inspection have successfully established themselves on today’s market for electronic manufacturing equipment. The VERSAPRINTs have long since outgrown the status of being “only a simple printer” and have transformed themselves into full-fledged multifunctional systems. Extending 2D inspection, Ersa now presents the VERSAPRINT 3D-SPI – with even more process control and still minimal floor space requirements.


The idea for the integrated 3D-SPI (SPI is short for „solder paste inspection“) was around for a while, but it needed a viable system base to be realized, which Ersa found in the printer platforms VERSAPRINT P1 and S1. When selecting a suitable method to integrate into the existing printer concept, it became apparent that only the laser triangulation method was suitable. In 3D-SPI systems, the object to be measured is scanned by a laser line and all relevant height information along the line scanned is determined.